In collaboration with Priest Corporation, Rensselaer Polytechnic Institute has recently developed a new type of low-cost, fast-drying polymer. Using this material can significantly reduce the cost of semiconductor manufacturing and computer chip packaging and increase efficiency. This new material, called epoxy-silicone-polyester resin (PES), made possible a new generation of low-cost chip nanoimprint lithography.
It is understood that the use of this new material by chip makers can cut down on several production steps from production to packaging, thereby reducing costs. At the same time, the cure temperature of PES is 165°C, which is 35% lower than traditional materials, so less heat is needed in the manufacturing process. Another advantage of PES is less than 0.2% water absorption, superior to other materials. In addition, PES can fully adhere to copper. These attributes all make PES a candidate for redistribution layer applications and UV imprint lithography.
It is understood that the use of this new material by chip makers can cut down on several production steps from production to packaging, thereby reducing costs. At the same time, the cure temperature of PES is 165°C, which is 35% lower than traditional materials, so less heat is needed in the manufacturing process. Another advantage of PES is less than 0.2% water absorption, superior to other materials. In addition, PES can fully adhere to copper. These attributes all make PES a candidate for redistribution layer applications and UV imprint lithography.